Laser cutting machine
Introduction:
Laser cutting has high precision and is an ideal tool for forming and processing of flexible circuit board。The focused laser can process the material into any shape。Laser cutting molding machine adopts international advanced technology semiconductor pumped solid-state ultraviolet laser, which can provide high power and higher stability at high repetition rate, so as to obtain higher work efficiency
UV laser cutting machine is designed for low cost laser processing customers。High efficient and fast PCB, pcba, FPC module, semiconductor shape cutting, plate splitting, etc.; high precision laser processing, better cost performance。Even in the case of high tolerance requirements, laser can cut complex shape directly on the substrate according to design data。The edge of the contour is neat, smooth and free of burr, and dust will not be generated。The operation cost is reduced and the time of product change is reduced。The fixture platform integrated in the equipment can firmly fix the base material on the position, so that the processing quality is higher and the unit cost is lower
The flexible circuit board and organic covering film can be precisely cut without mold or protection board fixation。By using high-energy laser source and accurately controlling the laser beam, the processing speed can be effectively improved and the accurate processing results can be obtained
Equipment features:
1. Customers choose to configure various types of UV lasers according to their needs, with stable power and small attenuation, without worrying about the influence of power attenuation on cutting quality and speed
2. After the optimized design of optical circuit, the speed and effect can be optimized at the same power. Meanwhile, the effective protection treatment of all optical path can be carried out, which can effectively reduce the cleaning maintenance period of equipment shutdown.
3. The equipment adopts marble shockproof platform, the overall structure is stable and firm, and the integrated closed structure provides guarantee for high speed, high precision and high yield production.
4. High precision guide rail, linear motor drive, 0.5 μ m optical grating full closed loop feedback control, high precision machine
5. Standard superior adsorption platform, high yield
6. The laser cutting software developed by ourselves is based on Windows system, which is easy to operate in Chinese and English, with powerful and diverse functions and simple and convenient operation.
7. Intelligent automaticity: using high-precision CCD automatic positioning, focusing, positioning fast and accurate, without manual intervention, simple operation, realize the same type of one button mode, greatly improve the production efficiency. The whole process is automated.
8. High performance laser: it adopts the international first-class brand solid-state ultraviolet laser, with the advantages of good beam quality, small focusing spot, uniform power distribution, small thermal effect, small slit width, high cutting quality, which is the guarantee of perfect cutting quality.
Scope of application:
Appearance molding and cutting processing of semiconductor chips, fingerprint module BR and other products
The process of the handset camera module, HDI board and PCBA board
FPC plate lamination hole, window, appearance forming, plate processing
Parameter:
Laser type |
UV laser |
Rated laser power |
15W |
Platform movement stroke |
X axis 30mm |
Y axis 350mm |
|
Platform maximum idle speed(mm/s)
|
1000
|
Lens processing speed(mm/s)
|
≤3500
|
Linear motor table positioning accuracy
|
±5μm
|
Repeatability of linear motor table
|
±3μm
|
CCD positioning accuracy
|
±5μm
|
Scope of work
|
450mmX400mm (can be customized according to customer requirements)
|
Cutting thickness
|
According to the product material and laser selection
|
CCD automatic positioning accuracy
|
±3μm
|
Single working size
|
40mmх40mm/60mmx60mm
|
Galvanometer repeatability
|
±1μm
|
Cutting size accuracy
|
<30μm
|
Cutting position accuracy
|
<50μm
|
Processing edge |
<20μm (depending on the material)
|
Processable file format
|
Standard Gerber files, DXF files, PLT files, etc.
|
Machine starting power
|
220V/15A/50Hz
|
Machine size
|
1250mmx1600mmx1650mm
|
Machine weight
|
1350kg
|
Environmental requirements
|
Room temperature 18℃-25℃, humidity <60%, no condensation (air conditioner constant temperature required)
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